16th January 2007 – San Jose, California - Wi2Wi, a leading provider of OEM communications products for Tier 1 PC OEMs and wireless systems for PAN, WAN and LAN, announces a completely integrated, class-leading Bluetooth and Wi-Fi system-in-package with  built-in coexistence as part of its continuing innovation on multi-function wireless solutions.

WPAN and WLAN are the two most widely implemented technologies in mobile, power-sensitive terminals such as cell phone / smart phones, PDAs, and MP3/MP4 devices. Focusing on solutions for this market, Wi2Wi has mastered the design and production of System in Package (SiP) technology, which can increase functional density, reduce size and simplify the development and manufacturing processes.

Wi2Wi's W2CBW003 SiP combines industry leading Bluetooth 2.0 + EDR (Enhanced Data Rate) and 802.11b/g Wi-Fi connectivity solutions in a single, 12mm x 12mm x 1.4mm package, enabling device manufacturers to more quickly and more efficiently support multiple wireless technologies. The W2CBW003 SiP is a full system solution, including clock and voltage regulation functions and delivers a complete dual radio solution. All functionality, including the radio modem, interface control, diagnostics, timing, power regulation and coexistence are included in a certified, compact ready to integrate package.

Bluetooth 2.0+ EDR can deliver data rates up to 3-times faster than current Bluetooth devices - and lower power consumption.Wi-Fi support is provided by a multi-mode 802.11b/g solution, enabling wireless networking in the 2.4GHz frequency bands, and at data rates of up to 54Mbps. In addition to Bluetooth and Wi-Fi connectivity, the W2CBW003 features UART, USB and SDIO interfaces and a Solder Down connection.

"We are very pleased to be able to take the Wi2Wi W2CBW003 SiP to market with its much in demand combination of WLAN and the 2.0+EDR version of Bluetooth technology," said Ramzi Alharayeri, founder and CEO of Wi2Wi. "As market demand increases for completely connected devices, the W2CBW003 combines the expertise of the industry's leading Bluetooth and Wi-Fi semiconductor companies with Wi2Wi's SiP expertise. This is an unbeatable solution for OEM and ODM solution providers needing access to a simple to integrate, small, low power dual-standard RF device."

The W2CBW003  is available now in a development kit [pn W2CBW003-UARTDEV or W2CBW003-USBDEV] and in  5 -pack samples [pn W2CBW003-SAM].  Volume production is scheduled for February 2007.

For further information visit the Wi2Wi web site: www.wi2wi.com

Contacts:

Wi2Wi, Inc.
James Kraemer
Director, Business Development
Tel:  +1-408-416-4205
Email:  James@wi2wi.com

PR contact:
Vince Holton
Email:  vholton@click.co.uk
Tel:  +44-1730-895614

About Wi2Wi, Inc.
 
Headquartered in San Jose, California, Wi2Wi is a leading provider for PAN (Personal Area Network), LAN (Local Area Network), and WAN (Wide Area Network) embedded solutions. Wi2Wi was formed as a result of a 2005 management buy-out of the Actiontec Electronics OEM Division's products, IP and assets.
 
Since 1997 the division has been a premier supplier  of modems and wireless solutions for Tier 1 US PC and laptop computer companies including IBM, Dell, H-P and Gateway. Throughout its history, the division delivered a series of industry firsts including built-in modems, laptop 802.11 Wi-Fi, and Bluetooth®   solutions for the OEM Market.

Managed by experienced executives from Actiontec and leading industry companies, Wi2Wi is now focused on building its Advanced Technology Division to offer next generation System in Package (SiP) solutions. Wi2Wi will provide complete wireless system solutions for PAN, WAN and LAN by combining the latest technologies along with its packaging IP to provide lower power, integrated products for tomorrow's portable devices.
 
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