One technology - Bluetooth - has gone a long way to changing that. Whilst Wi-Fi/WLAN has enjoyed some success in the corporate/PC market, it is Bluetooth that has really persuaded consumers that they may be able to make the wireless dream a reality. So much so that now, wireless is becoming pervasive and consumer appetite for the ability to connect to multiple networks is severely challenging the device manufacturer and the technology companies. They are under huge pressure to deliver multi-mode wireless connectivity NOW, and at the same time to make products smaller and smaller, while continuing to add functionality. And Bluetooth has dragged forward the delivery of other wireless technologies such as UWB, ZigBee, RFID and NFC. Each in its own way answers problems that Bluetooth cannot solve as a result of bandwidth restrictions, power consumption, range or cost.

Statistics detailing shipments of consumer portable devices tell the story. As an example, worldwide unit shipments of portable audio players (HDD and solid-state), will reach 104 million units in 2009, up from 27.8 million units in 2004. This represents a healthy compound annual growth rate (CAGR) of 30.2% between 2004 and 2009. HDD player shipments will have a remarkable CAGR of 36.9% between 2004 and 2009. This will be caused by aggressive pricing in this segment, as well as the success of mid-capacity players, such as Apple's 6GB iPod mini, Rio's 6GB Carbon, and iRiver's 6 GB model in its H10 series.

Every consumer electronics manufacturer is now faced with the challenge of integrating not just one, but two or more wireless technologies into its products. These are often companies with limited RF skills. Help is at hand, and the problem of integrating multiple-mode wireless in a small form factor is solved by Wi2Wi, a company that specialises in providing multi-mode, small form factor wireless PAN, WAN and LAN solutions to OEMs, integrators and device designers. Wi2Wi has mastered the design and production of System in Package (SiP) technology, which can increase functional density, reduce size and simplify the development and manufacturing processes.

This is a young company, but one with a solid base of industry experience. Headquartered in San Jose, California, Wi2Wi's was formed as a 2005 management buy-out of Actiontec Electronics OEM division's product, IP and assets. As a result, Wi2Wi has substantial skill sets to call upon. In 1997 Actiontec was the first supplier of IBM-branded PCMCIA modems, and followed this to become the first company to design and manufacture built-in notebook modems for Tier 1 US laptop computer companies including Dell and Gateway, and was first to design and manufacture 802.11b modules for the US PC OEMs including HP, IBM and Gateway.

Taking Wi2Wi forward today is a team of experienced executives from leading industry companies, including founder, Ramzi Alharayeri, President & CEO (formerly VP & GM of Actiontec's OEM Products Division), Dhiraj Sogani, General Manager & Senior Vice President, Advanced Technology (formerly co-founder and VP Engineering & Marketing at Iconic) and  Libo He, VP System and Platform Engineering (formerly GM of Product Design for Universal Communication Technology, a Panasonic and UTStarcom Joint Venture). The team's focus is on building Wi2Wi's Advanced Technology Division to offer next generation System in Package (SiP) solutions, and a software team to provide complete system level solutions. Wi2Wi is actively developing product IP - designing hardware and software solutions that can easily be integrated into consumer devices - and will provide complete, cost-effective wireless system solutions in SiP for PAN, WAN and LAN by combining discreet parts and adding advanced software features.

Why is Wi2Wi focusing upon wireless combination technologies in SiP? Robert Ragusano explained, "The market is driving device companies to make products smaller and smaller, while adding additional functionality. This presents a problem of integration which Wi2Wi solves by delivering multi-mode wireless functionality in a SiP." Wireless SiP is a combination of RF circuit design and advanced packaging which results in a small form factor and ease of radio integration. Wi2Wi's time-to-market cycles are similar to PCB design cycles while offering the densities of ceramic products.

Wi2Wi's route to market is via a series of fully integrated, pre-certified modules that incorporate SiP platforms - combining wireless systems such as Bluetooth and Wi-Fi - that can be regarded as 'off the shelf' solutions by OEM customers. Any OEM considering the development of discrete solutions can instead use these certified modules, benefiting from reduced technical risk and development costs, improved electrical performance, improved reliability and being able to allocate a smaller area for the radio. Equally important, the OEM will enjoy reduced manufacturing costs, and less time is needed to manage its supply chain.

Then there is the undoubted benefit of accelerated time-to-market.

This last point is always a vital element - nobody wants to launch products late. The use of certified modules is a fail-safe way for OEMs to multi-mode wireless-enable their products without needing to wait the often lengthy period that the semiconductor manufacturers take to go from single to multi-function silicon. This can often be between 18 - 36 months after a single mode chip has been launched. Wi2Wi is able to provide the same features of multi-mode silicon solutions but in a much more timely manner. Furthermore, because Wi2Wi develops its multi-function SiPs around single-function radios, it can offer best-in-class RF technology to its customers.

One further important factor is that the use of certified radio products lessens the risk and uncertainty of certifying product which has a unique design. Certification is complex, costly and takes time. This is not an overhead that an OEM will want to take on if there is a tailor-made and convenient option.

The Wi2Wi System in Package (SiP) solution

Robert Ragusano expanded upon the advantages of his company's chosen technical strategy; "System in Package (SiP) is the future for wireless integration. The challenge and cost of developing the necessary skills to design, develop, certify and manufacture radio solutions diverts investment away from a company's core competencies. The benefits of SiP over a silicon-down solution include simplification of the system-level design complexity, a reduction in the need for RF expertise on the part of the OEM/ODM and improved electrical performance and reliability. And there is no doubting the value of a faster time to market over system-level solutions - typically we are talking 6 months to a year for each new SiP product."

All of which means that customers for Wi2Wi's SiP solutions will be able to more quickly and more efficiently wirelessly-enable products, and support multiple technologies.

Markets that Wi2Wi is servicing

So who are those customers, and into what product areas will WI2Wi's technology be applied? The application areas for Wi2Wi's SiP/module solutions are actually very broad. Target markets include manufacturers of smartphone/cellphones, MP3/MP4 & personal video players, PDA/handheld computers and consumer devices such as digital/video cameras, GPS, etc. It doesn't stop there. In addition to the portable, low-power markets, Wi2Wi will also address the PC, Medical, Industrial, M2M, Automotive and Accessory Products sectors with board-level wireless products.

Where these specialized markets are concerned, Wi2Wi offers another key advantage - commercial flexibility. Wi2Wi's technology is very scalable. A major OEM may be able to attract the interest of a large semiconductor company when volumes are in the multi-millions, but not every electronics company operates on such scales. "We are able to support multiple volume tiers," said Ramzi Alharayeri. "Our business model allows for us to support small and mid-size customers who many only need 100,000 devices per year. Typical ceramic solution providers cannot economically address smaller markets. We can, and our model can still be scaled up for high-volume customers."

Wi2Wi product preview

All of which brings us to the realisation of Wi2Wi's concept - the first product to come to market. This is a fully compliant Dual Mode Radio SiP that supports dual ISM Band 802.11b/g and Bluetooth version 2.0 + EDR. Any regular observer of the electronics/wireless industries will know that this is a key combination. The W2CBW001 is a fully developed coexistence solution that provides full support for 802.11e (QoS) and 802.11i (Security) and which has an SDIO Interface for 802.11b/g and UART or USB Interface option for Bluetooth. One of the key advantages of SiP is its small footprint, and in this case that means dimensions of just 15mm x 15mm x 1.5mm in a 4-layer BT substrate, with LGA.

Wi2Wi's SiP roadmap extends into the future with other wireless solutions including a GPS + Bluetooth + Wi-Fi product and also Bluetooth + UWB. Where required, Wi2Wi can also develop custom products in response to particular customer requirements. An example of this is a single-function 802.11 SiP solution currently in development to meet a specific requirement.

The future

Whilst Wi2Wi sees SiP as centric to its future roadmap, the company has not forgotten its roots. Alongside development of its SiP products, Wi2Wi will continue to develop board-level products and support its PC Card and module customers. Wi2Wi's existing portfolio includes multiple products including modems, 802.11 and Bluetooth products.

Wi2Wi is managed today by experienced industry leaders who have demonstrated leadership in bringing innovative and world-class products to the OEM markets, including many world firsts. The Wi2Wi team is fully committed to enabling OEMs in the electronics industry to deliver products that support multiple wireless networks, and which can be shipped to consumers within the correct timescale and at the right price.

Re-Print from Incisor, April 2006 edition