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04/03/2006 - San Jose, California - Wi2Wi, a leading provider of wireless PAN, WAN and LAN solutions to OEMs, announces a major initiative to deliver the next generation of embedded wireless systems utilising System in Package (SiP) technology. Wi2Wi's multi-function SiP solutions will increase functional density, reduce size and simplify development and manufacturing processes.
Wireless SiP is a combination of RF circuit design and advanced packaging which results in a small form factor and ease of radio integration.
The consumers' appetite for wireless functionality continues to challenge the device manufacturers' and the technology companies' abilities to deliver wireless products that address multiple networks. Wi2Wi SiP products will allow OEMs to support combo-product socket opportunities before multi-function ICs are available.
Customers for Wi2Wi's SiP solutions will be able to more quickly and more efficiently develop products, including products that utilize multiple wireless technologies. Wi2Wi's target market is manufacturers of smartphone/cellphones, MP3/MP4 and personal video players, PDA/handheld computers and consumer devices such as digital/video cameras, GPS, etc. In addition to the portable, low-power markets, Wi2Wi will address the PC, Medical, Industrial, M2M, Automotive and Accessory Products sectors with board-level wireless products.
"The market is driving device companies to make products smaller and smaller, while adding functionality. This presents a problem of integration which Wi2Wi solves by delivering multi-mode wireless solutions in SiP," said Robert Ragusano, Vice President of WW Sales and Marketing, Wi2Wi. The benefits of multi-function SiP over a silicon-down solution include simplification of the system-level design complexity and the reduction in the need for RF expertise on the part of the OEM/ODM. Ragusano further explained the Wi2Wi value proposition by explaining, "Multi-function SiP also provides manufacturers with faster time to market over system-level solutions - typically we are talking 6 months to a year. This compares very favorably to the 18 - 36 months a silicon manufacturer will take to progress from a single function IC to a Multi-Mode IC that combines, for example, Bluetooth and 802.11b/g. Finally, our SiP solutions allow for us to use best-in-class RF technologies from a variety of suppliers to deliver the best overall solution."
Wi2Wi's technology is scalable. "We are able to support multiple volume tiers," said Ramzi Alharayeri, Wi2Wi's founder, President & CEO. "Our business model allows for us to support small and mid-size customers who many only need 100,000 devices per year. Typical ceramic solution providers cannot economically address smaller markets. We can, and our model can be scaled up for high-volume customers."
Alongside development of its SiP products, Wi2Wi will continue to develop board-level products and support its standard module customers. Wi2Wi's existing portfolio includes multiple products including modems, 802.11 and Bluetooth modules. Wi2Wi wireline and wireless products are currently shipping to Tier 1 OEMs in volume.
Wi2Wi is managed today by experienced industry leaders who have demonstrated leadership in bringing innovative and world-class products to the OEM markets, including many world firsts.
For further information visit the Wi2Wi web site: www.wi2wi.com
Contacts:
James Kraemer Director, Business Development Tel: +1-408-416-4205 Email: james@wi2wi.com
PR contact:
Vince Holton Email: vholton@click.co.uk Tel: +44-1730-895614
About Wi2Wi, Inc.
Headquartered in San Jose, California, Wi2Wi is a leading provider of PAN (Personal Area Network), LAN (Local Area Network), and WAN (Wide Area Network) embedded solutions.
Wi2Wi was formed as a 2005 management buy-out of Actiontec Electronics OEM division's product, IP and assets. Managed by experienced executives from leading industry companies, Wi2Wi is focused on building its Advanced Technology Division to offer next generation System in Package (SiP) solutions and a software team to provide complete system level solutions.
Based on the consumer's burgeoning appetite for connecting mobile devices to multiple wireless networks, Wi2Wi is actively developing product IP - designing hardware and software solutions that can easily be integrated into consumer devices. Wi2Wi provides a complete, cost-effective wireless system solution in SiP for PAN, WAN and LAN by combining discreet parts and adding advanced software features.
Wi2Wi is privately funded. The Bluetooth® word mark and logos are owned by the Bluetooth SIG, Inc. and any use of such marks is under license. |